ELECTRO CERMIC & DEVICE GROUP
High Frequency & Hermetic Package
Sentec provides LTCC substrate that can be used under highly hermetic circumstances.
The hermetic level of 5.0 x 10-8Pa x m3/sec is assured through helium leak testing.
Also, Sentec offers Hybrid Solution thru. Interconnection Technology for high frequency application:
Photonics & Thermal Electricity
ECC (Electro Casting Copper) is an excellent choice for high power, high temperature applications.
ECC technology could be applied on:
With high conductivity substrate and high reliability, Sentec offer three solutions:
Interposer & Heterogeneous Substrate
Sentec provides multilayer ceramic substrates, with multilayer thin-film metallization for wafer probe cards. • Low Loss LTCC w/ Electro Casting Copper Metallization + Non-Shrinkage LTCC
Turnkey Semiconductor Module Packaging OEM
Sentec offers turnkey solutions for module assembly.
Depending on the nature of the project, we can perform:
Level 1 & 2 IC Packaging & Technology